• -43%

28 az 1-ben mobiltelefon BGA IC chipjavító pengekészlet iPhone CPU-eltávolító logikai kártya NAND Flash

28 az 1-ben mobiltelefon BGA IC chipjavító pengekészlet iPhone CPU-eltávolító logikai kártya NAND Flash

339 Ft 43% megtakarítás
595 Ft
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28 in 1 Mobile Phone BGA IC Chip Repair Blades Kit for iPhone CPU Remover Logic Board NAND Flash Repair Tools
Description:
Proffesional repair tool set for mobile phone CPU disassemble.
One handle and 27 pcs blades in different shapes.
Good for BGA repair,dismantling phone IC chip.
It can be used to separate the welding spot.

Specification:
Material: Alloy steel,Metal
Handle length: 138 mm
Handle diameter: 8 mm
What's in the Package:
27 x IC Chip Repair Blades
1 x Handle
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28 in 1 Mobile Phone BGA IC Chip Repair Blades Kit for iPhone CPU Remover Logic Board NAND Flash Repair Tools
Description:
Proffesional repair tool set for mobile phone CPU disassemble.
One handle and 27 pcs blades in different shapes.
Good for BGA repair,dismantling phone IC chip.
It can be used to separate the welding spot.

Specification:
Material: Alloy steel,Metal
Handle length: 138 mm
Handle diameter: 8 mm
What's in the Package:
27 x IC Chip Repair Blades
1 x Handle
4000420844534 - wl_xv
4000420844534

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28 az 1-ben mobiltelefon BGA IC chipjavító pengekészlet iPhone CPU-eltávolító logikai kártya NAND Flash

28 in 1 Mobile Phone BGA IC Chip Repair Blades Kit for iPhone CPU Remover Logic Board NAND Flash Repair Tools
Description:
Proffesional repair tool set for mobile phone CPU disassemble.
One handle and 27 pcs blades in different shapes.
Good for BGA repair,dismantling phone IC chip.
It can be used to separate the welding spot.

Specification:
Material: Alloy steel,Metal
Handle length: 138 mm
Handle diameter: 8 mm
What's in the Package:
27 x IC Chip Repair Blades
1 x Handle

Write your review