- -40%
5db/tétel 3D nyomtató alkatrészek, hővezető hűtőborda vakolat viszkózus ragasztós összetett ragasztó PC GPU IC-hez
5db/tétel 3D nyomtató alkatrészek, hővezető hűtőborda vakolat viszkózus ragasztós összetett ragasztó PC GPU IC-hez
331 Ft
40% megtakarítás
551 Ft
Nincs adó
Features:
It has high strength and fast bonding effect.
Used to paste heat sink with IC chips,and be cooling body with good thermal effect.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.
In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free.
Instructions:
1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again;
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Specification:
Thermal conductivity: >0.671W/m.k
Breaking strength: 1.5MPA
Surface vulcanization time: 10Min/25°C
Material: Silicone
Capacity: 5g
Length: 52mm/2.05inch
Color: As shown
Quantity: 1 Pc
Package includes:
5 x Thermal Silicone Adhesive
It has high strength and fast bonding effect.
Used to paste heat sink with IC chips,and be cooling body with good thermal effect.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.
In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free.
Instructions:
1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again;
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Specification:
Thermal conductivity: >0.671W/m.k
Breaking strength: 1.5MPA
Surface vulcanization time: 10Min/25°C
Material: Silicone
Capacity: 5g
Length: 52mm/2.05inch
Color: As shown
Quantity: 1 Pc
Package includes:
5 x Thermal Silicone Adhesive
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