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TEC1-12706 12703 12704 12705 12708 12709 12710 12712 12715 Termoelektromos hűtő Peltier 40*40MM 12V Peltier Elemente Modul
TEC1-12706 12703 12704 12705 12708 12709 12710 12712 12715 Thermoelectric Cooler Peltier 40*40MM 12V Peltier Elemente Module
Description :
Get ice cold in minutes or heat to boiling by simply reversing the polarity, used for numerous applications from CPU coolers to alternate power sources, or even for your own
custom car drink warmer/cooler.
Since they consit primarily of semiconductor material sandwiched between ceramic plates and have no moving parts
These devices must be used in conjunction with a heat sink to avoid burned
Each device is full inspected and tested
 
 
TEC1-12703 40*40 12V3A
Model:TEC1-12703
Rated voltage:12V
Rated current:3A
Cooling capacity:29.7W
Maximum temperature difference:65 °
Dimensions:40*40*4.6
Positive and negative:Red positive, black negative
 
TEC1-12704 40*40 12V4A
Chip type: TEC1-12704
Overall dimensions: 40*40*4.0mm element 127
Wire specification: lead length 300 5mm RV standard wire single head 5mm tin plating
Internal resistance: 3.0~3.3 ohm (ambient temperature 23 - 1 DEG C, 1kHZ Ac)
Maximum temperature: Tmax (Qc=0) 63 DEG C.
Working current: Imax=4A (rated voltage)
Rated voltage: DC12V (Vmax:15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: temperature range -55 DEG C to 83 C (high ambient temperature will directly affect the efficiency of refrigeration)
Packaging: Standard 704 silicone rubber seal
Packaging standard: foam box packaging, storage conditions ambient temperature -10 C ~ 40 C
Storage conditions: -40~60
 
TEC1-12705 40*40
Chip Type: TEC1-12705 
Dimensions: 40 * 40 * 3.8mm element number 127 on 
Internal resistance: 2.5 ~ 2.8Ω (ambient temperature of 23 ± 1 , 1kHZ Ac test) 
Maximum temperature:  Tmax (Qc = 0) over 67 . 
Working current: Imax = 4.3-4.6A (rated at 12V) 
Rated voltage: 12V (Vmax: 15V starting current 5.8A) 
Refrigeration power: Qcmax 50-60W 
Working environment: temperature range -55  ~ 83  (high ambient temperatures drop directly affect the cooling efficiency) 
Packaging process: four weeks standard 704 silicone rubber seal
TEC1-12706 40*40
Chip Type: TEC1-12706
External dimensions: 40 * 40 * 3.75mm
Internal resistance: 2.1 ~ 2.4Ω (ambient temperature of 23 ± 1 'C, 1kHZ Ac test)
The maximum temperature difference:  Tmax (Qc = 0) above 59 'C.
Working current: Imax = 4.3-4.6A (rated at 12V)
Rated voltage: 12V (Vmax: 15V starting current 5.8A)
Cooling power: Qcmax 55W
Working environment: temperature range -55 'C ~ 83'C (high ambient temperature drop directly affect the cooling efficiency)
 
 
TEC1-12708 40*40
Chip Type: TEC1-12708
External dimensions: 40 * 40 * 3.5mm
Internal resistance: 1.5 ~ 1.8 Ω (23 / - 1degree, environment temperature 1 KHZ Ac test)
The largest temperature difference: delta Tmax (Qc = 0) more than 67degree
Working current: Imax = 8 (rated voltage startup)
Rated voltage: DC12V (Vmax: 15.5 V)
Cooling power: 77 w Qcmax
The assembly pressure: 85 n/cm2
Working conditions: temperature range and 55degree~ 83degree (high environmental temperature will directly affect the cooling efficiency)
Encapsulation process: standard around 704 silicone rubber seal
Packing: bubble box packing, storing conditions - 10degree to 40degree ambient temperature
Storage conditions: - 40 ~ 60degree
TEC1-12709 40*40MM
Chip Model: tec1-12709
Overall dimensions: 40*40*3.5mm component Logarithm 127 pairs
Wire specification: lead long 300±8mm RV standard conductor single head 5mm tin plating
Internal resistance: 1.4~1.5ω (ambient temperature 23±1°, 1kHZ AC test)
Maximum temperature difference: 62 ° above
Working current: imax=7.1A (max voltage. 5V start 9A)
Rated Voltage: $literal (maximum voltage: 5V)
Cooling power: 86W (high cooling surface temperature will reduce cooling power)
Assembling pressure: 85n/cm2
Working environment: Temperature range -55°~83° (high ambient temperature will directly affect refrigeration efficiency)
Packaging process: Ambient standard 704 Silicone rubber seal
Packaging standards: Foam box packaging, storage conditions ambient temperature -10°~40°
Storage conditions:-40~60°
Power Requirements: Single voltage 12V, current 9A above the working power supply (series and parallel use)
Device characteristics: Red line positive, black line negative (there is literally refrigeration surface, no literal heat dissipation surface)
 
TEC1-12710 40*40
Chip: TEC1-12710
Dimension: 40 * 40 127 * 3.4 mm components logarithmic
Wire specifications: 300 / - 5 mm long RV lead wire single head 5 mm tin plating
Internal resistance value: 1.2 ~ 1.5 Ω (23 / - 1degree, environment temperature 1 KHZ Ac test)
Maximum temperature difference: delta Tmax (Qc = 0) above 60degree.
Working current: Imax = 10 a voltage (vmax 15 starts)
Rated voltage: DC12V (Vmax: 15.5 V)
Cooling power: 92 w Qcmax
The assembly pressure: 85 n/cm2
Working conditions: temperature range and 55degree ~ 83degree (high environmental temperature will directly affect the cooling efficiency)
Encapsulation process: standard around 704 silicone rubber seal
Packing: bubble box packing, storing conditions - 10degree to 40degree ambient temperature
Storage conditions: - 40 ~ 60degree
 
TEC1-12712 40*40
Type: TECI-12712
Couples: 127
Imax (A): 12
Umax (V):15.4
Qcmax(w) T =0: 109
Tmax (°) Qc=0: 68
Size: 40*40*3.4mm
TEC1-12715 40*40
Model: TEC1-12715 
Size: 40mm x 40mm x 4mm 
Operates from 0~15.4V DC and 0~15A 
Operates Temperature: -40 to 90 
Max power consumption: 165 Watts 
4001308230505/9 - sitai