- -43%
Kapacitancia: - 10 DB 102M 222M 471M 221K 300VAC SMD-Y2 biztonsági kerámia kondenzátor 300VAC-hoz
Kapacitancia: - 10 DB 102M 222M 471M 221K 300VAC SMD-Y2 biztonsági kerámia kondenzátor 300VAC-hoz
243 Ft
43% megtakarítás
426 Ft
Nincs adó
Product information
1: Ultra-thin product: to reduce the height of hybrid integrated circuit components, and replace the traditional plug-in Y-CAP with patch Y-CAP.
2: Using chip Y-cap back-attachment (board height <2.6mm) process design, using HIC two-sided space intensive design, effectively reducing the total area and thickness of HIC, and realizing miniaturization of hybrid integrated circuit products.
3: Optimize design and impMrove reliability: by designing the chip Y-cap back to keep it away from other power-type components on the front, avoiding Y-cap temperature rise due to heat release and thermal breakdown failure caused by poor heat dissipation ; At the same time, avoid inter-electrode arc discharge when the distance between the components is too close.
4: Realize the effect:
(1) Chip Y-capSMD reel and tape packaging, suitable for SMT automatic surface mounting, instead of PCB plug-in installation.
(2) Improve customer production efficiency and save labor and system costs.
(3) Improve the consistency level of customer product quality, and avoid the low probability of plug-in technology, false welding and other defects
1: Ultra-thin product: to reduce the height of hybrid integrated circuit components, and replace the traditional plug-in Y-CAP with patch Y-CAP.
2: Using chip Y-cap back-attachment (board height <2.6mm) process design, using HIC two-sided space intensive design, effectively reducing the total area and thickness of HIC, and realizing miniaturization of hybrid integrated circuit products.
3: Optimize design and impMrove reliability: by designing the chip Y-cap back to keep it away from other power-type components on the front, avoiding Y-cap temperature rise due to heat release and thermal breakdown failure caused by poor heat dissipation ; At the same time, avoid inter-electrode arc discharge when the distance between the components is too close.
4: Realize the effect:
(1) Chip Y-capSMD reel and tape packaging, suitable for SMT automatic surface mounting, instead of PCB plug-in installation.
(2) Improve customer production efficiency and save labor and system costs.
(3) Improve the consistency level of customer product quality, and avoid the low probability of plug-in technology, false welding and other defects
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