- -41%
559 10cc NC-559-ASM-UV Folyasztópaszta ólommentes forrasztópaszta forrasztófolyasztószer Tűfrissítés az RMA-223-hoz
265 Ft
41% megtakarítás
449 Ft
Nincs adó
NC-559-ASM-UV lead-free solder paste solder flux 10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
Biztonsági feltételek
Szállításii feltételek
Visszaküldési feltételek
559 10cc NC-559-ASM-UV Folyasztópaszta ólommentes forrasztópaszta forrasztófolyasztószer Tűfrissítés az RMA-223-hoz
559 10cc NC-559-ASM-UV Flux paste lead-free solder paste solder flux Needles upgrade for RMA-223
NC-559-ASM-UV lead-free solder paste solder flux 10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
1005001496683621 - suq
559 10cc NC-559-ASM-UV Flux paste lead-free solder paste solder flux Needles upgrade for RMA-223
NC-559-ASM-UV lead-free solder paste solder flux 10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
1005001496683621 - suq
1005001496683621
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NC-559-ASM-UV lead-free solder paste solder flux 10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives
Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint
Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time
The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste
With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test
Usage:
Phone repair,
PC BGA,
Electronics welding, soldering
Flux Type: NC-559-ASM-UV
Volume:10cc
