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NC-559-ASM Soldering Paste Fit For BGA CSP Ball Semiconductor Package Repair Kit
Detail:
*This NC-559-ASM Soldering Paste is used for BGA/CSP ball, semiconductor packaging, repair.
*No-clean solder paste, very little and colorless residue,without washing.
*Suitable for computer motherboard north and south bridge, communications, graphics or other BGA.
*Excellent soldering paste, just use a little each time.
*Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.
*Item Condition:100% Brand New
*Color: As Pictures Show
*Capacity: 10CC
*Model:NC-559-ASM
Package Contents:
1*NC-559-ASM Soldering Paste
Notes: The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
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